IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits. Everyone wants small size and ...
Packaging shapes consumers’ split-second decisions by conveying quality, usability, brand values and sustainability while protecting the product.
For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.
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Packaging as competitive advantage

Strategic packaging enables businesses to influence consumers, cut costs, build brand recognition and drive long-term ...
Packaging has always been a balancing act. Consumer packaged goods (CPG) companies must weigh cost versus performance and market appeal versus machinability. As interest in sustainable packaging has ...
OrbitIO interconnect designer capabilities deliver hierarchical multi-substrate-optimized design for SoCs and ASICs across IC package/SiP and systems SAN JOSE, Calif., May. 04, 2016 – Cadence Design ...
Responding to growing environmental concerns, companies across industries are searching for ways to make their products more sustainable. Many factors come into play when determining whether a product ...
Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...
As one of the fastest-growing, highly regulated industries in the country, the cannabis industry has been a potential goldmine for years. Brands have evolved from illicit-market-esque branding with ...
The Army’s premier training for military packaging has a new home. The Army Sustainment Command Packaging, Storage, and Containerization Center (PSCC), located on-post at Tobyhanna Army Depot, has ...