Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...

Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...

Ultra-wide bandgap semiconductors exhibit advantageous electronic properties that make them promising for high-voltage, high-power electronics applications. Building on over a decade of progress in ...

Global leading PV product and solution innovator DMEGC Solar has announced its appearance at SNEC 2025 International Photovoltaic Power Generation and Smart Energy Conference & Exhibition, taking ...

The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

Adoption of silicon carbide (SiC) is becoming more widespread among electric-vehicle (EV) systems such as dc-dc converters, traction inverters, and on-board chargers (OBCs) with bidirectional ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

This four-year outdoor field test report authoritatively confirms the comprehensive power generation advantages of N-type TOPCon modules over BC modules. Thanks to their outstanding bifacial power ...