Taiwan's MPI Corporation, a major producer of probe cards and semiconductor test equipment, said artificial intelligence infrastructure demand is driving capacity utilization to maximum levels, with ...

The growing adoption of advanced processes below 3nm for AI GPUs and AI ASIC chips is driving a surge in test points and shrinking pitch sizes during the chip probing (CP) stage. Industry players ...

Contact resistance, or CRES, is one of those problems that most engineers prefer not to think about until it’s staring them in the face. For years, it could be managed quietly with routine probe card ...

High-bandwidth memory (HBM) is an important part of AI processors, handling massive data processing and computations. In response, Teradyne, Inc. has launched the Magnum 7H, a next-generation memory ...