Advanced packaging can be an alphabet soup of possible approaches, from heterogenous integration of multiple die types into a single package, to three-dimensional stacking of multiple dies on top of ...

Researchers have developed a stacking technology for a magneto-resistive random access memory (MRAM) to separately form a single-crystal tunnel magnetoresistive (TMR) thin film and then bond it to a ...

A nanoelectronics research institute has announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. Scientists recently demonstrated the first functional 3D integrated ...

Stacking ultrathin complex oxide single-crystal layers allows researchers to create new structures with hybrid properties and multiple functions. Now, using a new platform, researchers will be able to ...

(Nanowerk News) The magnetic, conductive and optical properties of complex oxides make them key to components of next-generation electronics used for data storage, sensing, energy technologies, ...

MADISON, Wis. -- The magnetic, conductive and optical properties of complex oxides make them key to components of next-generation electronics used for data storage, sensing, energy technologies, ...