Why thin film patterned substrates are often the foundation for critical electronics in aerospace and defence systems.

KYOTO, Japan--(BUSINESS WIRE)--Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor ...

As the growth in global electricity need and supply continues to accelerate, efficient power electronics will be key to improving grid efficiency, stability, integration, and resilience for all energy ...

LONDON--(BUSINESS WIRE)--According to the latest market study released by Technavio, the global low-temperature co-fired ceramic (LTCC) substrate market is projected to grow to USD 285.13 million by ...

Exploring Leading Suppliers Delivering Advanced Metal Core PCB Solutions for LED Lighting, Automotive Electronics, and ...

Where ceramic packaging and substrates are employed. Why designing solutions with ceramic packaging and substrates is challenging. Ceramic packaging and substrates address high-performance and ...

Three-dimensional products such as this touch sensor are electronically printed at the binder Innovation and Technology ...

To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging Built from Kyocera’s ...

Atomic force microscopy (AFM) shows the surface of the TaC thin film before and after annealing at high temperatures. The initial film surface is composed of many columnar grains, whereas after ...