Dynamic optimisation and model predictive control (MPC) are at the forefront of modern process systems engineering, offering robust methodologies to address the challenges posed by time-varying ...
A mathematical model that uses microwave spectroscopic methods to interpret EtO measurements may provide a powerful software tool for process engineers. by Zhangwu Zhu and Ian P. Matthews Figure 1.
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
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