Imec and semiconductor equipment supplier EV Group (EVG) have demonstrated a wafer-to-wafer hybrid bonding process capable of achieving a 200-nanometre copper interconnect pitch, marking a step ...

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This process enables full control of the polishing depth, sub-nanometer surface roughness, and wafer-scale uniformity of Si 3 N 4 waveguide height with variation below 3%, critical for monolithic or ...