As many big businesses will confirm, having multiple cloud systems on board can often be a major headache, particularly when it comes to interoperability. AWS is looking to solve these issues with a ...
“Smiths Interconnect has a highly complementary portfolio of advantaged solutions that strongly enhances the platform established by our acquisition of AirBorn last November,” said Joe Nelligan, CEO ...
Oct 16 (Reuters) - Smiths Group (SMIN.L), opens new tab said on Thursday it will sell its interconnect unit to U.S. electronic components maker Molex Electronic in a deal valued at 1.3 billion pounds ...
Foxconn Interconnect Technology (FIT) unveiled its latest high-speed interconnect and thermal management solutions aimed at enhancing 224G generation transmission and energy efficiency at the 2025 ...
The issue of how to interconnect clusters of racks in data centers will become more crucial as artificial intelligence grows. Traditional copper cabling becomes unwieldly and limited in performance as ...
AMD's chiplet architecture has not really changed in a fundamental way since the introduction of the Ryzen 3000 processors based on the Zen 2 architecture back in 2019. The move to Socket AM5 ...
TAIPEI, Sept 17 (Reuters) - Foxconn Interconnect Technology's (6088.HK), opens new tab Saudi Arabian joint venture will start building its first manufacturing base in the Middle East in December, ...
With cloud computing, HPC, and now AI driving enterprise computing and the technical challenges and cost connected to semiconductor design and manufacturing increasing, demand for chiplet ...
CAMPBELL, Calif. – August 4, 2025 – Arteris, Inc. (Nasdaq: AIP), a provider of semiconductor system IP for accelerating system-on-chip (SoC) creation, today announced AMD (Nasdaq: AMD) has licensed ...
A new co-packaged optics (CPO) solution claims to set the bar for next-generation interconnects serving hyperscale data centers and artificial intelligence (AI) workloads. Broadcom’s third-generation ...
A new technical paper titled “FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates” was published by researchers at ETH Zurich. “Chiplet ...
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